Buried Metal for FinFET Device and Method

ABSTRACT

A semiconductor device includes a buried metal line disposed in a semiconductor substrate, a first dielectric material on a first sidewall of the buried metal line and a second dielectric material on a second sidewall of the buried metal line, a first multiple fins disposed proximate the first sidewall of the buried metal line, a second multiple fins disposed proximate the second sidewall of the buried metal line, a first metal gate structure over the first multiple fins and over the buried metal line, wherein the first metal gate structure extends through the first dielectric material to contact the buried metal line, and a second metal gate structure over the second multiple fins and over the buried metal line.

PRIORITY

This application claims the benefit to U.S. Provisional PatentApplication No. 62/592,499 filed Nov. 30, 2017, and entitled “Tie OffDevice with Buried Metal Layer,” which application is incorporatedherein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However, asthe minimum features sizes are reduced, additional problems arise thatshould be addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a perspective view of a fin field-effect transistor (“FinFET”)device in accordance with some embodiments.

FIGS. 2-42 illustrate cross-sectional views of intermediate stages inthe formation of buried metal lines in a semiconductor device inaccordance with a first embodiment.

FIGS. 43A-44 illustrate cross-sectional views and a plan view ofintermediate stages in the formation of buried metal lines in asemiconductor device in accordance with a some embodiments.

FIGS. 45A-47D illustrate cross-sectional views and plan views ofintermediate stages in the formation of dummy gate stacks in accordancewith a first embodiment.

FIGS. 48A-D illustrate cross-sectional views and plan views ofintermediate stages in the formation of metal gate stacks in accordancewith a first embodiment.

FIG. 49 illustrates a cross-sectional view of an intermediate stage inthe formation of epitaxial source/drain regions in accordance with afirst embodiment.

FIGS. 50-75 illustrate cross-sectional views of intermediate stages inthe formation of buried metal lines in a semiconductor device inaccordance with a first embodiment.

FIGS. 76A-78D illustrate cross-sectional views and plan views ofintermediate stages in the formation of dummy gate stacks in accordancewith a first embodiment.

FIGS. 79A-D illustrate cross-sectional views and plan views ofintermediate stages in the formation of metal gate stacks in accordancewith a first embodiment.

FIG. 80 illustrates a cross-sectional view of an intermediate stage inthe formation of epitaxial source/drain regions in accordance with afirst embodiment.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments will be described with respect to a specific context,namely, a FinFET device including buried metal lines and a method offorming the same. Various embodiments discussed herein allow for the useof buried metal lines that may be connected to the metal gate of aFinFET cell. Using a self-aligned process, the metal gates of respectiveFinFET cells may be selectively connected (“tied-on”) to the buriedmetal lines or isolated from the buried metal lines. The techniquesdescribed herein allow for isolation between adjacent metal gateswithout significantly increasing area. Various embodiments presentedherein are discussed in the context of FinFETs formed using a gate-lastprocess. In other embodiments, a gate-first process may be used. Thefin(s) of a FinFET device or the gate(s) of a FinFET device may bepatterned by any suitable method. For example, the fins or gates may bepatterned using one or more photolithography processes, includingdouble-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers may be formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers, or mandrels, may then be usedto pattern the fins. Some embodiments contemplate aspects used in planardevices, such as planar FETs. Some embodiments may also be used insemiconductor devices other than FETs.

FIG. 1 illustrates an example of a fin field-effect transistor (FinFET)30 in a three-dimensional view. The FinFET 30 includes a fin 36 on asemiconductor substrate 32. The fin 36 protrudes above and from betweenneighboring isolation regions 34, which are disposed over portions ofthe semiconductor substrate 32. In some embodiments, isolation regions34 are not used. A gate dielectric 38 is along sidewalls and over a topsurface of the fin 36, and a gate electrode 40 is over the gatedielectric 38. Source/drain regions 42 and 44 are disposed in oppositesides of the fin 36 with respect to the gate dielectric 38 and gateelectrode 40. FIG. 1 further illustrates reference cross-sections thatare used in subsequent figures. Cross-section A-A is across a channel,gate dielectric 38, and gate electrode 40 of the FinFET 30.Cross-section C-C is in a plane that is parallel to cross-section A-Aand is across fin 36 outside of the channel (e.g., across thesource/drain region 42). Cross-section B-B is perpendicular tocross-section A-A and is along a longitudinal axis of the fin 36 and ina direction of, for example, a current flow between the source/drainregions 42 and 44. Subsequent figures refer to these referencecross-sections for clarity.

FIGS. 2-48D illustrate cross-sectional views of intermediate stages inthe formation of a FinFET device 100, according to a first embodiment.FIGS. 2-43A and 44 are illustrated along the reference cross-section A-Aof FIG. 1. The FinFET device 100 is similar to that shown in FIG. 1, butmultiple fins 138 and multiple metal gates 150A-F are formed.

FIG. 2 illustrates a substrate 102. The substrate 102 may be asemiconductor substrate, such as a bulk semiconductor, asemiconductor-on-insulator (SOI) substrate, or the like, which may bedoped (e.g., with a P-type or an N-type dopant) or undoped. Thesubstrate 102 may be a wafer, such as a silicon wafer. Generally, an SOIsubstrate includes a layer of a semiconductor material formed on aninsulator layer. The insulator layer may be, for example, a buried oxide(BOX) layer, a silicon oxide layer, or the like. The insulator layer isprovided on a substrate, typically a silicon substrate or a glasssubstrate. Other substrates, such as a multi-layered or gradientsubstrate may also be used. In some embodiments, the semiconductormaterial of the substrate 50 may include silicon; germanium; a compoundsemiconductor including silicon carbide, gallium arsenic, galliumphosphide, indium phosphide, indium arsenide, and/or indium antimonide;an alloy semiconductor including SiGe, GaAsP, AlInAs, AlGaAs, GaInAs,GaInP, and/or GaInAsP; or combinations thereof.

FIG. 2 further illustrates the formation of a first material 104 and asecond material 106 over the substrate 102. The first material 104 orthe second material 106 may include silicon oxide (SiO), silicon nitride(SiN), silicon oxynitride (SiON), silicon carbide (SiC), siliconcarbonitride (SiCN), silicon oxycarbonitride (SiOCN), a combinationthereof, or the like. In some embodiments, the first material 104 or thesecond material 106 may include a metal or nitride material such astitanium nitride, titanium, tantalum nitride, tantalum, a combinationthereof, or the like. In some embodiments, the composition of the firstmaterial 104 is different from the composition of the second material106. In this manner, selective etching processes (e.g., selective wetetches or selective dry etches) may be used in subsequent steps whenetching the first material 104 or the second material 106. The firstmaterial 104 or the second material 106 may be formed using any suitableprocess, such as atomic layer deposition (ALD), physical vapordeposition (PVD), chemical vapor deposition (CVD), a combinationthereof, or the like. In some embodiments, the first material 104 may beformed as a layer having a thickness between about 5 nm and about 25 nm.In some embodiments, the second material 106 over the first material 104may be formed as a layer having a thickness between about 5 nm and about25 nm. The first material 104 or the second material 106 may be formedhaving other thicknesses in other embodiments. In some embodiments, thethickness of the first material 104 or the second material 106 maydepend on the materials chosen for the first material 104 and the secondmaterial 106, and may depend on the selectivity of one or more etchingprocesses chosen to etch the first material 104 or the second material106.

A mandrel material is formed over the second material 106 and patternedto form first mandrels 108. The first mandrels 108 may be a materialthat has a high etching selectivity with the underlying layer, e.g.,with the second material 106. For example, the first mandrels 108 may bea material such as SiO, SiN, SiON, SiC, SiCN, SiOCN, a nitride material,or another type of material that is different than the second material106. The first mandrels 108 may be formed using a process such as ALD,PVD, CVD, or the like. In some embodiments, the first mandrels 108 maybe formed having a thickness between about 1 nm and about 5 nm, oranother thickness. The mandrel material may be patterned to form firstmandrels 108 using any suitable photolithography technique and etchingtechnique.

In FIG. 3, a first spacer material is formed over the second material106 and the first mandrels 108 and then etched to form first spacers110. After formation, the first spacer material extends along topsurfaces of the second material 106 and top surfaces and sidewalls ofthe first mandrels 108. A suitable etching process is performed toremove horizontal portions of the first spacer material to form firstspacers 110. The etching process may be, for example, an anisotropic dryetching process. The first spacers 110 may be a material selected tohave a high etching selectivity with second material 106 or the firstmandrels 108. In some embodiments, the first spacers 110 may be formedfrom a material such as SiO, SiN, SiON, SiC, SiCN, SiOCN, a nitridematerial, or another type of material that is different than the secondmaterial 106 or the first mandrels 108, and may be formed using anysuitable process such as ALD, PVD, CVD, or the like. In someembodiments, the first spacers 110 may be formed having a width betweenabout 1 nm and about 5 nm, or another thickness.

In FIG. 4, the first mandrels 108 are removed and a protective mask 112is formed over some of the first spacers 110. The first mandrels 108 maybe removed using a suitable etching process, such as a dry etchingprocess, a wet etching process, or a combination. The etching processmay be selective to the first mandrels 108 over the first spacers 110 orthe second material 106. After the first mandrels 108 have been removed,the protective mask 112 is formed over some of the first spacers 110, asshown in FIG. 4. The protective mask 112 may be a photoresist or othersuitable material, and may be patterned using suitable photolithographictechniques.

In FIG. 5, a trimming process is performed on the first spacers 110 notcovered by the protective mask 112. The trimming process reduces thesize of the exposed first spacers 110, forming trimmed first spacers110′. The trimming process may include a dry etching process, a wetetching process, or a combination. After the trimming process isperformed, the protective mask 112 is removed.

In FIG. 6, the first spacers 110 and trimmed first spacers 110′ are usedas an etching mask to pattern the first material 104 and the secondmaterial 106. The first material 104 and the second material 106 may beetched using one or more suitable etching processes. For example, thefirst material 104 or the second material 106 may be etched usinganisotropic dry etching processes. After patterning the first material104 and the second material 106, a protective mask 114 is formed overthe untrimmed first spacers 110. The protective mask 114 may be, forexample, a photoresist, and may be patterned using a suitablephotolithographic process.

In FIG. 7, the trimmed first spacers 110′ and the portions of the secondmaterial 106 not covered by the protective mask 114 are removed. Thetrimmed first spacers 110′ and the second material 106 may be removedusing one or more suitable etching processes, such as a dry etchingprocess, a wet etching process, or a combination. The etching processmay be selective to the second material 106 over the first material 104.In this manner, exposed portions of the first material 104 remain overthe substrate 102, as shown in FIG. 7. The exposed portions of the firstmaterial 104 have a pattern corresponding to the trimmed first spacers110′. After the etching process is performed, the protective mask 114 isremoved.

In FIG. 8, a third material 116 is formed over the substrate 102 andbetween the patterned portions of the first material 104. The thirdmaterial 116 may be a material such as SiO, SiN, SiON, SiC, SiCN, SiOCN,a nitride material, the like, or a combination thereof, and may beformed using a process such as ALD, PVD, CVD, or the like. In someembodiments, the third material 116 may be a different material than thesubstrate 102, the first material 104, or the second material 106. Insome embodiments, the third material 116 may be deposited and thenetched back (e.g., using a timed etch) such that the remaining portionsof the third material 116 have a thickness about the same as theremaining portions of the first material 104. In FIG. 9, the remainingportions of the first spacers 110 are removed using a suitable dryetching process, a wet etching process, or a combination.

In FIG. 10, a second spacer material is deposited and then etched toform second spacers 118 adjacent the portions of the second material106. The second spacers 118 may have a high etching selectivity with thesecond material 106 or the third material 116. The second spacers 118may be a material similar to that of the first spacers 110 or be adifferent material. In some embodiments, the second spacers 118 may beformed having a thickness about the same as the remaining portions ofthe second material 106. In some embodiments, a suitablephotolithographic patterning process and etching are used to pattern thesecond spacer material and form the second spacers 118.

In FIG. 11, a first photoresist 120 is formed over the exposed portionsof the first material 104. The first photoresist 120 may be formed usinga spin-on process or another suitable process, and patterned usingsuitable photolithographic techniques. The first photoresist 120protects portions of the second spacers 118 during subsequent processingsteps. In some cases, the first photoresist 120 may extend above theheight of the second spacers 118 or extend over portions of the secondspacers 118. In FIG. 12, the remaining portions of the second material106 are removed using a suitable etching process. For example, theetching process may include a dry etching process, a wet etchingprocess, or a combination. In some embodiments, the etching process maybe selective to the second material 106 over the first material 104, thesecond spacers 118, and/or the first photoresist 120.

In FIG. 13, the exposed portions of the first material 104 are removedusing a suitable etching process. For example, the etching process mayinclude a dry etching process, a wet etching process, or a combination.In some embodiments, the etching process may be may be selective to thefirst material 104 over the substrate 102. In some cases, both theportions of the second material 106 (described as being removed abovewith reference to FIG. 12) and the portions of the first material 104may be removed in a single etching process.

In FIG. 14, the first photoresist 120 is removed. The first photoresist120 may be removed, for example, using a dry process (e.g., an ashingprocess) or a wet process (e.g., a wet chemical process). In FIG. 15, atrimming process is performed on the second spacers 118. The trimmingprocess reduces the size of the second spacers 118. The trimming processmay include a dry etching process, a wet etching process, or acombination.

In FIG. 16, a third spacer material is deposited and then etched to formthird spacers 124 adjacent the second spacers 118. The material of thethird spacer material may be selected to have a high etching selectivitywith the second spacer 118 or the third material 116. The third spacers124 may be a material similar to that of the first spacers 110 or be adifferent material. In some embodiments, the third spacers 124 may havea thickness about the same as the second spacers 118. In someembodiments, a suitable photolithographic patterning process and etchingprocess is used to pattern the third spacer material and form the thirdspacers 124.

In FIG. 17, exposed portions of the third material 116 are removed usinga suitable etching process. For example, an anisotropic dry etchingprocess may be used to remove the portions of the third material 116. Insome embodiments, the etching process may be selective to the thirdmaterial 116 over the material of other features such as the substrate102, the first material 104, the second spacers 118, or the thirdspacers 124. In FIG. 18, the second spacers 118 are removed using asuitable etching process. For example, a dry etching process or a wetetching process may be used to remove the second spacers 118. In someembodiments, the etching process may be selective to the material of thesecond spacers 118 over that of the third spacers 124, first material104, etc.

In FIG. 19, a fourth spacer material is deposited and then etched toform fourth spacers 126. The fourth spacer material may be selected tohave a high etching selectivity with, for example, the third material116. The fourth spacers 126 may be formed from a material such as SiO,SiN, SiON, SiC, SiCN, SiOCN, a nitride material, or another type ofmaterial, and may be formed using any suitable process such as ALD, PVD,CVD, or the like. In some embodiments, the fourth spacers 126 include amaterial similar to that of the first spacers 110. In some embodiments,the fourth spacer material may be formed having a thickness betweenabout 1 nm and about 10 nm, which may fill the lateral gaps between thefirst material 104 and the third material 116. The fourth spacermaterial may also be formed having another thickness in otherembodiments. As shown in FIG. 19, a suitable etching process isperformed to remove horizontal portions of the fourth spacer material.The etching process leaves sidewall portions of the fourth spacermaterial remaining to form fourth spacers 126. The etching process maybe, for example, an anisotropic dry etching process.

In FIG. 20, a second photoresist 128 is formed to fill regions betweenthe fourth spacers 126. The second photoresist 128 may be formed using aspin-on process or another suitable process. In FIG. 21, exposedportions of the third spacers 124 are replaced by the first material104. For example, the exposed third spacers 124 may be removed using anetching process selective to the third spacers 124. The etching processmay be a dry etching process, a wet etching process, or a combination.The first material 104 may then be formed in the regions formerly filledby the exposed third spacers 124. The first material 104 may be formedusing a deposition technique as described previously. In some cases, aCMP process may be performed after the first material 104 is formed.

In FIG. 22, a protective mask 130 is formed over portions of thestructure, and then exposed portions of the first material 104 areremoved. The protective mask 130 may be, for example, a photoresist, andmay be patterned using a suitable photolithographic process. The exposedfirst material 104 may be removed using a dry etching process, a wetetching process, or a combination. The removal of the exposed firstmaterial 104 forms openings that expose portions of the third material116, as shown in FIG. 22.

In FIG. 23, the openings formed by removal of the exposed first materialare extended through the third material and into the substrate 102,forming recesses 121 in the substrate 102. The protective mask 130 isalso removed. The exposed portions of the third material 116 and thesubsequently removed portions of the substrate 102 may be removed usingone or more dry etching processes, wet etching processes, or acombination. In some embodiments, the recesses 121 may extend a depthinto the substrate a distance between about 50 nm and about 140 nm.

In FIG. 24, a conductive material 131 is formed over the structure andwithin the recesses 121. In some embodiments, layers may be formed inthe recesses 121 prior to forming the conductive material 131. Forexample, a liner, a barrier layer, an adhesion layer, a seed layer, oranother type of layer, or a combination of these, may formed before theconductive material 131 is formed. One or more of the layers may includetitanium, titanium nitride, tantalum, tantalum nitride, or the like. Theconductive material 131 may include copper, a copper alloy, silver,gold, tungsten, aluminum, nickel, cobalt, a combination, or the like.The conductive material 131 may be formed using a suitable depositiontechnique, such as electroplating, CVD, PVD, the like, or a combination.The conductive material 132 is used to form buried metal 132, describedbelow.

In FIG. 25, a planarization process such as a CMP process is used toremove excess conductive material 132. Then, in FIG. 26, a protectivemask 134 is formed over regions other than the recesses 121, and anetching process is used to remove portions of the conductive material131 from the recesses 121. The remaining conductive material 132 formsburied metal 132, which may be conductive features such as buried metallines. The etching process may be a dry etching process, a wet etchingprocess, or a combination. For example, the etching process may includean anisotropic dry etching process.

In FIG. 27, a hard mask material 135 is formed on the buried metal 132within the recesses 121. In some embodiments, hard mask material 135 isa dielectric material and may include SiO, SiN, SiON, SiC, SiCN, SiOCN,a nitride material, or another type of material. The hard mask material135 may be formed using any suitable process, such as ALD, PVD, CVD, acombination thereof, or the like. In some embodiments, the protectivemask 134 is removed after the hard mask material 135 has been formedusing a wet etching process or a dry etching process. In someembodiments, excess hard mask material 135 outside of the recesses 121is removed using a planarization process (e.g., a CMP process). A timedetch may then be performed to etch the hard mask material 135 within therecesses 121 such that a desired amount of hard mask material 135remains over the buried metal 132.

In FIG. 28, a second deposition of the third material 116 is performed,forming the third material over the hard mask material 135 within therecesses 121. The third material 116 may be formed using a previouslydescribed deposition technique for forming the third material 116. Aplanarization process such as a CMP process may be performed after thethird material 116 is deposited. In FIG. 29, the second photoresist 128is removed. The second photoresist 128 may be removed, for example,using a dry process (e.g., an ashing process) or a wet process (e.g., awet chemical process). In FIG. 30, an etching process is used to removeexposed portions of the third material 116. Portions of the thirdmaterial 116 over the buried metal 132 are left remaining after theetching process. In some cases, the top surface of the third material116 remaining over the buried metal 132 may be about level with the topsurface of other portions of third material 116, such as those coveredby the first material 104. In some embodiments, the etching systemperforming the etching process may be configured to detect when thesubstrate 102 is exposed and stop the etching process once the substrate102 beneath portions of the third material 116 is exposed. In someembodiments, the height of the remaining third material 116 over theburied metal 132 may be determined using a timed etching process. Theetching process may be a dry etching process, a wet etching process, ora combination. For example, the etching process may include ananisotropic dry etching process.

In FIG. 31, a second deposition of the first material 104 is performed.The first material 104 may be formed such that the top surfaces of thefirst material 104 are about level with the top surfaces of the fourthspacers 126. For example, a planarization process (e.g., a CMP process)may be performed after deposition of the first material 104. The firstmaterial 104 of FIG. 31 may have the same composition as the firstmaterial 104 of FIG. 2, and may be formed using the same depositiontechnique as previously described for the first material 104. In FIG.32, an etching process is used to remove exposed portions of the firstmaterial 104. Portions of the first material 104 are left remainingafter the etching process. In some cases, the top surface of the firstmaterial 104 remaining may be about level with the top surface ofportions of third material 116. In some embodiments, the etching systemperforming the etching process may be configured to detect when thethird material 116 is exposed and stop the etching process once thethird material 116 beneath the first material 104 is exposed. In someembodiments, the height of the remaining first material 104 may bedetermined using a timed etching process. The etching process may be adry etching process, a wet etching process, or a combination. Forexample, the etching process may include an anisotropic dry etchingprocess.

In FIG. 33, the hard mask material 136 is formed over the structure. Thehard mask material 136 may be formed such that the top surfaces of thehard mask material 136 are about level with the top surfaces of thefourth spacers 126. For example, a planarization process (e.g., a CMPprocess) may be performed to control the height of the hard maskmaterial 136. The hard mask material 136 may be a material similar tothat of hard mask material 135 described previously or may be adifferent material. In FIG. 34, the fourth spacers 126 are removed. Thefourth spacers 126 may be removed using a dry etching process, a wetetching process, or a combination. For example, an anisotropic dryetching process selective to the fourth spacers 126 over the hard maskmaterial 136 may be used. Removing the fourth spacers 126 exposesportions of the substrate 102.

In FIG. 35, an etching process is performed on the exposed portions ofthe substrate 102 to form recesses 123 in the substrate 102. The etchingprocess may include one or more dry etching processes, wet etchingprocesses, or a combination. In some embodiments, the recesses 123 inthe substrate 102 extend a depth into the substrate approximately equalto that of the recesses 121. After the etching process, first sidewallsof the buried metal 132 are exposed by the recesses 123. In FIG. 36, afifth spacer material 127 is formed within the recesses 123. In someembodiments, the fifth spacer material 127 is similar to the fourthspacers 126, though the fifth spacer material 127 may be different inother embodiments. The fifth spacer material 127 may be formed such thatthe top surface of the fifth spacer material 127 are about level withthe top surface of the first material 104 on the substrate 102. Forexample, the fifth spacer material 127 may be etched back afterdeposition using a timed etching process.

In FIG. 37, exposed portions of the third material 116 are removed. Theportions of the third material 116 may be removed using a dry etchingprocess, a wet etching process, or a combination. For example, ananisotropic dry etching process selective to the third material 116 overthe hard mask material 135 may be used. Removing the exposed portions ofthe third material 116 exposes portions of the substrate 102.

In FIG. 38, an etching process is performed on the exposed portions ofthe substrate 102 to form recesses 125 in the substrate 102. The etchingprocess may include one or more dry etching processes, wet etchingprocesses, or a combination. In some embodiments, the recesses 125 inthe substrate 102 extend a depth into the substrate approximately equalto that of the recesses 121 or the recesses 123. After the etchingprocess, second sidewalls of the buried metal 132 are exposed by therecesses 125.

In FIG. 39, a third deposition of the first material 104 is performed,forming the first material 104 within the recesses 125. The firstmaterial 104 may be formed such that the top surface of the firstmaterial 104 are about level with the top surface of the fifth spacermaterial 127. For example, the first material 104 may be etched backafter deposition using a timed etching process. The first material 104may be formed using a previously described deposition technique for thefirst material 104.

In FIG. 40, a trimming process is performed on the exposed hard maskmaterial 136. The trimming process reduces the size of the exposed hardmask material 136. The trimming process may include a dry etchingprocess, a wet etching process, or a combination. In some embodiments,after the trimming process, the exposed hard mask material 136 may havea width between about 1 nm and about 10 nm, or another width.

In FIG. 41, exposed portions of the first material 104, third material116, and fifth spacer material 127 are removed using one or more etchingprocesses. The one or more etching processes may include one or more dryetching processes, wet etching processes, or a combination. For example,one or more anisotropic dry etching processes may be used. In someembodiments, the exposed hard mask material 136 may be used as an etchmask for the etching of the first material 104, third material 116, andfifth spacer material 127.

In FIG. 42, exposed portions of the substrate 102 are removed, formingfins 138. The portions of the substrate 102 may be removed using a dryetching process, a wet etching process, or a combination. For example,an anisotropic dry etching process selective to the material of thesubstrate 102 over the first material 104, third material 116, fifthspacer material 127, or hard mask material 136 may be used. In someembodiments, the substrate 102 may be etched a depth such that thesurface of the substrate 102 between fins 138 is about level with topsurface of the hard mask material 135 disposed on the buried metal 132.In this manner, semiconductor fins 138 are formed protruding fromportions of the substrate 102. In some embodiments, the fins 138 mayhave a height between about 30 nm and about 100 nm, or a width betweenabout 1 nm and about 10 nm. In other embodiments, the semiconductor fins138 may have another height or another width. In some cases, havingfirst material 104 and third material 116 disposed on different fins 138allows the use of selective etching techniques to remove particularfins.

In FIG. 43A, exposed portions of the first material 104, third material116, and the fifth spacer material 127 that are not covered by the hardmask material 136 are removed using one or more etching processes. Theetching processes may include one or more dry etching processes, one ormore wet etching processes, or a combination. For example, anisotropicdry etching processes selective to the first material 104, thirdmaterial 116, and the fifth spacer material 127 over the hard maskmaterial 135 and the material of the substrate 102 may be used. In someembodiments, the exposed portions of the first material 104, thirdmaterial 116, and the fifth spacer material 127 may be etched a depthsuch that top surface of the etched first material 104, third material116, and fifth spacer material 127 are approximately level with a topsurface of the hard mask material 135 disposed on the buried metal 132.In FIG. 43A and subsequent Figures, the portion of third material 116remaining over the buried metal 132 has been labeled as third material116A.

In some embodiments, different “cells” of FinFETs may be separated andelectrically isolated by the third material 116A disposed over theburied metal 132. As illustrative examples, portions of cells 140A-F areindicated in the cross-sectional view of FIGS. 43A and the example planview of FIG. 43B. FIG. 43B shows the fins 138 of the cells 140A-F ashaving been isolated into rows, but in other embodiments, the fins 138may be isolated in a different process step or in a differentconfiguration. The cells may be, for example, cells of a SRAM array. Theburied metal 132 may be electrically connected to one or more metalgates of the FinFETs, or the metal gates of one or more cells, describedin greater detail below. In some embodiments, a portion of buried metal132 may extend adjacent multiple cells of FinFETs, and some or all ofthe multiple cells of FinFETs may be electrically connected together bybeing electrically connected to the same portion of buried metal 132.For example, as shown in FIG. 43B, the buried metal 132 may extendcontinuously along multiple rows of fins or along multiple cells, andmay be connected to some, none, or all of the fins or cells disposednext to the buried metal 132. A cell may include one or more fins 138used to form one or more FinFETs within that cell. As an exemplaryexample, a cell may contain 4 fins 138 that are used to form 6 FinFETs(i.e., for a six-transistor (6T) SRAM cell). Other numbers of fins 138(e.g., 2, 3, 6, etc.) or FinFETs in a cell are possible and within thescope of this disclosure.

In FIG. 44, an insulation material is formed over the substrate 102 andbetween neighboring fins 138, forming Shallow Trench Isolation (STI)148. The cross-sectional view of FIG. 44 may be along the examplecross-section AA-AA, shown in FIG. 45A. The STI 148 may be formed froman oxide, such as silicon oxide, a nitride, the like, or a combinationthereof, and may be formed by a high density plasma chemical vapordeposition (HDP-CVD), a flowable CVD (FCVD), the like, or a combinationthereof. In some embodiments, a planarization process such as a CMP maybe may be performed after the insulation material is formed. In someembodiments, the STI 148 may be recessed such that the top surface ofthe STI 148 is below the top surfaces of the fins 138.

FIGS. 45A-D, 46A-D, and 47A-D illustrate the formation of dummy gatestructures 147A-F over the fins 138 of FinFET device 100, according tosome embodiments. FIGS. 45A, 46A, and 47A show example plan views of aportion of FinFET device 100. FIGS. 45B, 46B, and 47B show examplecross-sectional views along cross-section BB-BB as indicated in FIGS.45A, 46A, and 47A. FIGS. 45C, 46C, and 47C show example cross-sectionalviews along cross-section CC-CC as indicated in FIGS. 45A, 46A, and 47A.FIGS. 45D, 46D, and 47D show example cross-sectional views alongcross-section DD-DD as indicated in FIGS. 45A, 46A, and 47A. Each ofcross-sections BB-BB, CC-CC, and DD-DD are perpendicular to thelongitudinal direction of the fins 138 and are across subsequentlyformed metal gate structures, as in the cross-section A-A shown inFIG. 1. Additionally, the first material adjacent the buried metal 132has been labeled as first material 104A,and the fifth spacer material127 adjacent the buried metal 132 has been labeled as fifth spacermaterial 127A.

In FIGS. 45A-D, the STI 148, the first material 104 disposed on the fins138, and the third material 116 disposed on the fins 138 are removedfrom regions 145A-F. The STI 148, the first material 104, and the thirdmaterial 116 may be removed from regions 145A-F using suitablephotolithographic techniques. For example, the STI regions 148, thefirst material 104, and the third material 116 may be removed using oneor more dry etching processes, one or more wet etching processes, or acombination. In some embodiments, the STI 148 in regions 145A-F areremoved before removing the first material 104 or the third material116. In some embodiments, anisotropic dry etching processes selective tothe first material 104 and the third material 116 may be used. In thismanner, the fins 138 in the regions 145A-F are exposed. In someembodiments, the STI 148 within the regions 145A-F may be recessed suchthat portions of the STI 148 remain within the regions 145A-F. Theregions 145A-F shown in FIGS. 46A and 47A are intended as non-limitingexamples, and other embodiments may include regions of a differentnumber, shape, size, or other characteristics.

In FIGS. 46A-D, portions of the first material 104A and the fifth spacermaterial 127A are removed to expose sidewall portions of the buriedmetal 132 within regions 145A-F. In the example embodiment shown inFIGS. 46A-D, none of the first material 104A or fifth spacer material127A is removed from region 145A or region 145B.

As shown in FIG. 46C, the fifth spacer material 127A is removed fromregion 145D, forming a recess 142 that exposes a sidewall of the buriedmetal 132. The fifth spacer material 127A may be removed using suitablephotolithographic techniques. For example, the fifth spacer material127A may be removed using one or more dry etching processes, one or morewet etching processes, or a combination. For example, an anisotropic dryetching process selective to the fifth spacer material 127A over thefirst material 104A may be used. In this manner, the conductive material132 is only exposed on the sidewall facing the fifth spacer material127A. In other words, the buried metal 132 is exposed by forming therecess 142 in region 145D and not exposed in region 145C. The buriedmetal 132 in region 145C remains isolated by the first material 104A andthe hard mask material 136. In some embodiments, the recess 142 may havea lateral aspect ratio as shown in FIG. 46A between about 1:5 and about1:10.

As shown in FIG. 46D, the first material 104A is removed from region145E, forming a recess 144 that exposes a sidewall of the buried metal132. The first material 104A may be removed using suitablephotolithographic techniques. For example, the first material 104A maybe removed using one or more dry etching processes, one or more wetetching processes, or a combination. For example, an anisotropic dryetching process selective to the first material 104A over the fifthspacer material 127A may be used. In this manner, the buried metal 132is only exposed on the sidewall facing the first material 104A. In otherwords, the buried metal 132 is exposed by forming the recess 144 inregion 145E and not exposed in region 145F. The buried metal 132 inregion 145F remains isolated by the fifth spacer material 127A and thehard mask material 136. In some embodiments, the recess 144 may have alateral aspect ratio as shown in FIG. 46A between about 1:5 and about1:10.

Because the buried metal 132 is isolated by the first material 104A onone side and isolated by the fifth spacer material 127A on the oppositeside, the first material 104A or the fifth spacer material 127A may beselectively etched to expose desired portions on either side of theburied metal 132. As such, the distance between the conductive materialand neighboring fins 138 may be reduced with less chance of processdefects, such as exposing both sides of the buried metal 132 in regionswhere only one side is intended to be exposed. In some embodiments, boththe first material 104A and the fifth spacer material 127A may beremoved from opposite sides of the buried metal 132.

In FIGS. 47A-D, dummy gate structures 146A-F are formed in regions145A-F. In some embodiments, the dummy gate structures 146A-F mayinclude multiple layers, such as a dummy dielectric layer, a dummy gatelayer, or other layers. A dummy dielectric layer may include, forexample, silicon oxide, silicon nitride, a combination thereof, or thelike, and may be deposited or thermally grown according to acceptabletechniques (e.g., thermal oxidation). A dummy gate layer may be formedover the dummy dielectric layer and may include, for example,polycrystalline-silicon (polysilicon), poly-crystallinesilicon-germanium (poly-SiGe), metallic nitrides, metallic silicides,metallic oxides, metals, or other materials. The dummy gate layer may bedeposited by physical vapor deposition (PVD), CVD, sputter deposition,or another technique. In some embodiments, the dummy gate structurematerials are blanket formed over the surface of the FinFET device 100,and then portions are removed using a suitable photolithographic processto form dummy gate structures 146A-F. In some embodiments, aplanarization process such as a CMP may be performed to remove excessdummy gate structure material. In some cases, the planarization processmay expose the third material 116A, as shown in FIGS. 47B-D. In someembodiments, one or more of the dummy gate structures 146A-F may beformed simultaneously by the same processing steps, or may be formedsequentially in separate processing steps.

In some embodiments, the dummy gate structures 146A-F are formed beforethe STI 148 is formed. For example, appropriate portions of the firstmaterial 104A and fifth spacer material 127A may be removed in regions145A-F as described above, then dummy gate structures 146A-F may beformed as described above. Portions of the dummy gate structures 146A-Fmay be removed outside of regions 145A-F via one or more etchingprocesses, and then STI 148 may be formed as described above. This andother variations of processing steps are within the scope of thisdisclosure.

In FIGS. 48A-D, the dummy gate structures 146A-F are removed andreplaced with metal gate structures 150A-F. The dummy gate structures146A-F may be removed using one or more dry etching processes, one ormore wet etching processes, or a combination. The metal gate structures150A-F may include gate dielectric layers, metal gate fill material, andother layers such as work-function layers, barrier layers, etc. FIG. 48Aalso shows interlayer dielectric (ILD) regions 152 that may be formed insome embodiments, for example, after removal of the STI regions 148. TheSTI regions 148 may be removed using a suitable etching process.

FIG. 49 is a cross-sectional view along cross-section AA-AA, showing theformation of epitaxial source/drain regions 151 over the fins 138. Insome embodiments, the epitaxial source/drain regions 151 or other FinFETfeatures may be formed prior to formation of the metal gate structures150A-F, such as gate spacers, additional ILD regions, or other features(not shown). The epitaxial source/drain regions 151 may be formed usingsuitable techniques as known in the art.

By selectively removing appropriate portions of first material 104A orfifth spacer material 127A adjacent the buried metal 132A shown in FIGS.47A-D, the metal gate structures 150A-F may contact (and thus makeelectrical connection to) the buried metal 132 or be isolated from theburied metal 132 as desired. For example, as shown in FIG. 48B, themetal gate structures 150A and 150B are isolated from one another andfrom the buried metal 132 by the third material 116A, the hard maskmaterial 135, the first material 104A, and the fifth spacer material127A. The first material 104A and the fifth spacer material 127A remainon sidewalls of the buried metal 132 prevent the metal gate structures150A and 150B from contacting the sidewalls of the buried metal 132 suchthat the metal gate structures 150A and 150B are electrically isolatedfrom one another.

As shown in FIG. 48C, the metal gate structure 150D is electricallyconnected to the buried metal 132A, but the metal gate structure 150C isisolated from the buried metal 132A by the third material 116A, thefirst material 140A, and the hard mask material 136. As shown in FIG.48D, the metal gate structure 150E is electrically connected to theburied metal 132A, but the metal gate structure 150F is isolated fromthe buried metal 132A by the third material 116A, the fifth spacermaterial 127A, and the hard mask material 136. In the example embodimentshown in FIGS. 48B-D, the metal gate structure 150D and the metal gatestructure 150E are both electrically connected to the buried metal 132Aand are thus both electrically connected to each other. Metal gatestructures 150A-E are illustrative examples, and metal gate structuresmay be connected or isolated from buried metal in other configurationsor combinations than shown.

FIGS. 50-80D illustrate cross-sectional views of intermediate stages inthe formation of a FinFET device 200, according to a second embodiment.FIGS. 50-76 are illustrated along the reference cross-section A-A ofFIG. 1. The FinFET device 200 is similar to FinFET device 100 shown inFIG. 1, but multiple fins 226 and multiple metal gates 234A-F areformed.

FIG. 50 illustrates the formation of a first material 204 over a topsurface of a substrate 202. The substrate 202 may be similar tosubstrate 102 described previously, or be a different type of substrate.The first material 204 may be similar to the first material 104described previously, or be a different material. For example, the firstmaterial 204 may be a material such as SiO, SiN, SiON, SiC, SiCN, SiOCN,a nitride material, or another type of material. The first mandrels 108may be formed using a process such as ALD, PVD, CVD, or the like. Insome embodiments, the first material 204 may be formed having athickness between about 5 nm and about 25 nm, though the first material204 may have another thickness in other embodiments.

In FIG. 51, a mandrel material is formed over the first material 204 andpatterned to form first mandrels 206. The mandrel material of the firstmandrels 206 may be different the first material 204, and may be similarto the mandrel material of first mandrels 108 described above. The firstmandrels 206 may be formed using similar techniques as described abovefor the first mandrels 108. In some embodiments, the first mandrels 206may be formed having a thickness between about 5 nm and about 25 nm,though the first mandrels 206 may have another thickness in otherembodiments. First spacers 208 are then formed on the sidewalls of thefirst mandrels 206. The material of the first spacers 208 may bedifferent than the material of the first mandrels 206 and may be similarto the first spacer material of the first spacers 110 describedpreviously. The first spacers 208 may be formed using similar techniquesas described above for the first spacers 110. For example, a suitabledry anisotropic etching process may be performed to remove horizontalportions of the material of the first spacers 208. In FIG. 52, the firstmandrels 206 are removed. The first mandrels 206 may be removed using asuitable etching process, such as a dry etching process, a wet etchingprocess, or a combination. The etching process may be selective to thematerial of the first mandrels 206 over the material of the firstspacers 208 or the first material 204.

In FIG. 53, second material 210 is formed over the first spacers 208 andthe first material 204. The second material 210 may be different thanthe material of the first mandrels 206 or the first material 204. Thesecond material 210 may be similar to the second material 106 describedabove, and may be formed in a similar manner. For example, the secondmaterial 210 may be a material such as SiO, SiN, SiON, SiC, SiCN, SiOCN,a nitride material, or another type of material. The second material 210may be formed using a process such as ALD, PVD, CVD, or the like. Insome embodiments, the second material 210 is formed having a thicknessthat is less than that of the first spacers 208.

In FIG. 54, an implantation process 212 is performed on portions of thesecond material 210. The implantation process 212 may implant one ormore species of ions such as boron, iron, other types of ions, acombination, or the like. In some cases, the implantation process 212may also implant ions into portions of the first spacers 208, the firstmaterial 104, or the substrate 202. In some embodiments, the substrate202 is tilted at an angle θ during the implantation process 212 suchthat the ions are directed obliquely at surfaces of the second material210. In some embodiments, the angle θ is between about 10° and about80°, though another implant angle may be used in other embodiments. Inthis manner, some portions of the second material 210 are shadowed fromthe ions, an example of which is shown in FIG. 54 as shadowed region209. Due to the ions being blocked during the implantation process 212,the shadowed portions of the second material 210 have a smallerconcentration of implanted ions than portions of the second material 210that are exposed to the ions. FIG. 55 illustrates implanted regions 214of the second material 210 which have a greater concentration of ionsdue to being exposed to ions during the implantation process 212 andshadowed regions 209 of the second material 210 which have a smallerconcentration of ions due to being shadowed to ions during theimplantation process 212.

In FIG. 56, the shadowed regions 209 of the second material 210, whichhave a smaller concentration of ions, are removed using a selectiveetching process, leaving the implanted regions 214. The selectiveetching process may be selective to the shadowed regions 209 of thesecond material 210 having a smaller concentration of ions over theimplanted regions 214 having a greater concentration of ions. Theselective etching process may include a wet etching process or a dryetching process. As an illustrative example, a wet etching process usingNH₄OH may selectively etch regions of the second material 210 having asmaller concentration of implanted boron (e.g., the shadowed regions209) over the implanted regions 214 having a greater concentration ofimplanted boron. Other wet etching processes or dry etching processesmay be used in other embodiments.

In FIG. 57, exposed portions of the first material 204 are removed. Theportions of the first material 204 may be removed, for example, by anetching process that is selective to the first material 204 over theimplanted regions 214 or the substrate 202. The etching process mayinclude a wet etching process or a dry etching process. In FIG. 58, theimplanted regions 214 are removed. The implanted regions 214 may beremoved, for example, by an etching process that is selective to theimplanted regions 214 over the first material 204 or the substrate 202.The etching process may include a wet etching process or a dry etchingprocess.

In FIG. 59, a third material 216 is formed over the first spacers 208,the first material 204, and the substrate 202. The third material 216may be similar to the first material 204 described above and may beformed in a similar manner, though the third material 216 may be adifferent material or be formed in a different manner in otherembodiments. For example, the third material 216 may be a material suchas SiO, SiN, SiON, SiC, SiCN, SiOCN, a nitride material, or another typeof material. The third material 216 may be formed using a process suchas ALD, PVD, CVD, or the like. In some embodiments, a planarizationprocess such as a CMP process may be performed to remove excess thirdmaterial 216 and expose the first spacers 208 after formation of thethird material 216. In FIG. 60, portions of the third material 216 areremoved using an etching process. After the etching process, theremaining third material 216 may have a thickness about the same as thefirst material 204 on the substrate 202. The etching process may alsoexpose portions of the first material 204. The etching process mayinclude a wet etching process or a dry etching process. For example, theetching process may be a timed etching process or include an etchingsystem configured to stop etching once exposure of the first material204 is detected.

In FIG. 61, second spacers 218 are formed on the first spacers 208. Thematerial of the second spacers 218 may be selected to have an etchingselectivity with, for example, the first spacers 208. For example, thesecond spacers 218 may be a material such as SiO, SiN, SiON, SiC, SiCN,SiOCN, a nitride material, or another type of material. The secondspacers 218 may be formed using a process such as ALD, PVD, CVD, or thelike. In some embodiments, the material of the second spacers 218 may beblanket deposited over the structure, and then horizontal portions ofthe material may be etched to form the second spacers 218. The etchingprocess may be, for example, an anisotropic dry etching process. In someembodiments, second spacers 218 may have a lateral width between about 1nm and about 10 nm, though the second spacers 218 may have anotherlateral width in other embodiments.

In FIG. 62, a photoresist 220 is formed to fill regions between thesecond spacers 218. The photoresist 220 may be formed using a spin-onprocess or another suitable process. As shown in FIG. 62, portions ofthe photoresist 220 between second spacers 218 are then removed to formopenings 221. The openings 221 may be patterned using a suitablephotolithographic process. In FIG. 63, portions of the first material204 exposed by the openings 221 are removed to extend the openings 221to the substrate 202. In some cases, portions of third material 216exposed by the openings 221 may also be removed. The first material 204(and third material 216, if present) may be removed using a suitableetching process, such as a wet etching process or a dry etching process.In some embodiments, the etching process is selective to the firstmaterial 204 over the first spacers 208 or the second spacers 218. InFIG. 64, the openings 221 are extended into the substrate 202 using anetching process. The etching process may include one or more dry etchingprocesses, wet etching processes, or a combination. In some embodiments,the openings 221 may extend a depth into the substrate 202 a distancebetween about 50 nm and about 100 nm, though the openings 221 may extendanother depth in other embodiments.

In FIG. 65, a conductive material is deposited in the openings 221 toform buried metal 222. The conductive material may be similar to theconductive material 132 described above, and may be formed in a similarmanner. For example, the conductive material may be deposited over theopenings 221 and excess conductive material outside of the openings 221may be removed using, for example, a CMP process. Conductive materialwithin the openings 221 may be then removed using a suitable wet or dryetching process, which may be a timed etching process.

In FIG. 66, a first hard mask material 219 is formed within the openings221 and on the buried metal 222. In some embodiments, the first hardmask material 219 is similar to the material of the second spacers 218,and may be formed in a similar manner. For example, first hard maskmaterial 219 may be a material such as SiO, SiN, SiON, SiC, SiCN, SiOCN,a nitride material, or another type of material. The first hard maskmaterial 219 may be formed using a process such as ALD, PVD, CVD, or thelike. In some embodiments, the first hard mask material 219 formed onthe sidewalls of the openings may be thinner than the first hard maskmaterial 219 formed on the buried metal 222. In some embodiments, excessfirst hard mask material 219 outside of the openings 221 is removed, forexample, using a CMP process. In FIG. 67, a trimming process isperformed on the first hard mask material 219 to remove portions of thefirst hard mask material 219 from sidewalls of the openings 221. In someembodiments, the trimming process may include a wet etching process, adry etching process, or a combination, and may include a timed etch.After the trimming process, a portion of the first hard mask material219 is left remaining over the buried metal 222.

In FIG. 68, portions of the photoresist 220 between second spacers 218are removed to form openings 223. The openings 223 may be adjacent tothe openings 221 and separated from openings 221 by a second spacer 218,as shown in FIG. 68. The openings 223 may be patterned and thephotoresist 220 removed using a suitable photolithographic process andetching process. In FIG. 69, portions of the first material 204 andthird material exposed by the openings 223 are removed to extend theopenings 223 to the substrate 202. The first material 204 and thirdmaterial 216 may be removed using a suitable etching process, such as awet etching process or a dry etching process. In some embodiments, theetching process is selective to the first material 204 or the thirdmaterial 216 over the first spacers 208 or the second spacers 218. InFIG. 70, the openings 223 are extended into the substrate 202 using anetching process, which may be similar to the etching process describedabove with respect to FIG. 64. After etching the substrate 202, anopening 221 may be separated from an opening 223 by a portion of thesubstrate 202 that is designated as dummy fin 227 in FIG. 70.

In FIG. 71, a conductive material is deposited in the openings 223 toform buried metal 224. The conductive material may be similar to theconductive material of buried metal 222 described above, and may beformed in a similar manner. In FIG. 72, a second hard mask material 225is formed within the openings 223 and on the buried metal 224. In someembodiments, the second hard mask material 225 is similar to the firstmaterial 204, and may be formed in a similar manner. For example, thesecond hard mask material 225 may be formed within the openings 223,followed by a trimming process. In some embodiments, the second hardmask material 225 may be formed over the openings 223, followed by aplanarization process. A timed etch may then be performed to etch thesecond hard mask material 225 within the openings 223, leaving a desiredamount of the second hard mask material 225 remaining over the buriedmetal 224.

In FIG. 73, the first spacers 208 and the photoresist 220 are removedusing one or more etching processes. The one or more etching processesmay include wet etching processes, dry etching processes, or acombination. The one or more etching processes may be selective to thematerial of the first spacers 208 or the photoresist 220 over the firstmaterial 204, the third material 216, the second spacers 218, or thesubstrate 202. In FIG. 74, one or more etching processes are performedto form fins 226 in substrate 202. The one or more etching processes mayinclude wet etching processes, dry etching processes, or a combination,which may include one or more timed etches. In some embodiments,portions of the first material 204 and third material 216 exposedbetween second spacers 218 are first etched to expose the substrate 202.The exposed portions of the substrate 202 between second spacers 218 arethen etched to form fins 226. In some embodiments, regions of thesubstrate 202 between fins 226 have a surface that is about level withthat of the top surface of the first hard mask material 219 and thesecond hard mask material 225. In some embodiments, the fins 226 have awidth between about 1 nm and about 10 nm. FIG. 74 also shows examplecells 240A-B, which are separated by dummy fins 227. In otherembodiments, cells may include a different number of fins 226 than shownin FIG. 74. In some embodiments, portions of buried metal 222 or 224 mayextend adjacent multiple cells of FinFETs, and some or all of themultiple cells of FinFETs may be electrically connected together bybeing electrically connected to the same portion of buried metal 222 or224. In some cases, having first material 204 and third material 216disposed on different fins 226 allows the use of selective etchingtechniques to remove particular fins.

In FIG. 75, an insulation material is formed over the substrate 202 andbetween fins 226, forming Shallow Trench Isolation (STI) 228. The STI228 may be similar to STI 148 described previously. In some embodiments,the STI 228 may be recessed such that the top surface of the STI 228 isbelow the top surfaces of the fins 226. The cross-sectional view of FIG.75 may be along the example cross-section AA-AA, which is shown in FIG.76A.

FIGS. 76A-D, 77A-D, and 78A-D illustrate the formation of dummy gatestructures 232A-F over the fins 226 of FinFET device 200, according tosome embodiments. FIGS. 76A, 77A, and 78A show example plan views of aportion of FinFET device 200. FIGS. 76B, 77B, and 78B show examplecross-sectional views along cross-section BB-BB as indicated in FIGS.76A, 77A, and 78A. FIGS. 76C, 77C, and 78C show example cross-sectionalviews along cross-section CC-CC as indicated in FIGS. 76A, 77A, and 78A.FIGS. 76D, 77D, and 78D show example cross-sectional views alongcross-section DD-DD as indicated in FIGS. 76A, 77A, and 78A. Each ofcross-sections BB-BB, CC-CC, and DD-DD are perpendicular to thelongitudinal direction of the fins 226 and are across subsequentlyformed metal gate structures, as in the cross-section A-A shown in FIG.1.

In FIGS. 76A-D, the STI 228, the first material 204 disposed on the fins226, the third material 216 disposed on the fins 226, and the secondspacers 218 disposed on the fins 226 are removed from regions 230A-Fusing suitable photolithographic techniques. For example, the differentmaterials may be removed using one or more dry etching processes, one ormore wet etching processes, or a combination. In some embodiments, theSTI 228 in regions 230A-F are removed before removing the othermaterials. In this manner, the fins 226 in the regions 230A-F areexposed. In some embodiments, the STI 228 within the regions 230A-F maybe recessed such that portions of the STI 228 remain within the regions230A-F. The regions 230A-F shown in FIGS. 46A and 47A are intended asnon-limiting examples, and other embodiments may include regions of adifferent number, shape, size, or other characteristics.

In FIGS. 77A-D, the first hard mask layer 219 is removed in region 230Dto expose the buried metal 222, and the second hard mask layer 225 isremoved in region 230E to expose the buried metal 224. The first hardmask layer 219 in region 230D and the second hard mask layer 225 inregion 230E may be removed using suitable photolithographic techniques.For example, an anisotropic dry etching process selective to the firsthard mask layer 219 over the second hard mask layer 225 may be used toremove the first hard mask layer 219 in region 230D. In this manner, thesecond hard mask layer 225 in region 230C is less likely to beinadvertently removed, exposing the buried metal 224. Similarly, ananisotropic dry etching process selective to the second hard mask layer225 over the first hard mask layer 219 may be used to remove the secondhard mask layer 225 in region 230E. Due to the fact that the first hardmask layer 219 and the second hard mask layer 225 may be selectivelyetched, the buried metal 222 may be formed closer to the buried metal224 and buried metal 222 with less risk of inadvertently exposing bothburied metal 222 and buried metal 224 when only one is desired to beexposed. Additionally, buried metal 222 and buried metal 224 may beformed closer to neighboring fins 226 with less risk of inadvertentlyexposing both buried metal 222 and buried metal 224.

In FIGS. 78-D, dummy gate structures 232A-F are formed in regions230A-F. In some embodiments, the dummy gate structures 232A-F may besimilar to dummy gate structures 146A-F described above. For example,the dummy gate structures 232A-F may include multiple layers, such as adummy dielectric layer, a dummy gate layer, or other layers. In someembodiments, the dummy gate structure materials are blanket formed overthe surface of the FinFET device 200, and then portions are removedusing a suitable photolithographic process to form dummy gate structures232A-F. In some embodiments, a planarization process such as a CMP maybe performed to remove excess dummy gate structure materials. In someembodiments, one or more of the dummy gate structures 232A-F may beformed simultaneously by the same processing steps, or may be formedsequentially in separate processing steps.

In some embodiments, the dummy gate structures 232A-F are formed beforethe STI 228 are formed. For example, appropriate portions of the firsthard mask layer 219 and the second hard mask layer 225 may be removed inregions 230A-F as described above, then dummy gate structures 232A-F maybe formed as described above. Portions of the dummy gate structures232A-F may be removed outside of regions 230A-F via one or more etchingprocesses, and then STI 228 may be formed as described above. This andother variations of processing steps are within the scope of thisdisclosure.

In FIGS. 79A-D, the dummy gate structures 232A-F are removed andreplaced with metal gate structures 234A-F. In some embodiments, someFinFET features may be formed prior to removal of the dummy gatestructures 234A-F, such as epitaxial source/drain regions, gate spacers,interlayer dielectric (ILD) regions, or other features (not shown). Thedummy gate structures 232A-F may be removed using one or more dryetching processes, one or more wet etching processes, or a combination.The metal gate structures 234A-F may include gate dielectric layers,metal gate fill material, and other layers such as work-function layers,barrier layers, etc. FIG. 79A also shows interlayer dielectric (ILD)regions 236 that may be formed in some embodiments, for example, afterremoval of the STI regions 228. The STI regions 228 may be removed usinga suitable etching process.

FIG. 80 is a cross-sectional view along cross-section AA-AA, showing theformation of epitaxial source/drain regions 251 over the fins 226. Insome embodiments, the epitaxial source/drain regions 251 or other FinFETfeatures may be formed prior to formation of the metal gate structures234A-F, such as gate spacers, additional ILD regions, or other features(not shown). The epitaxial source/drain regions 251 may be formed usingsuitable techniques as known in the art.

By selectively removing appropriate portions of the first hard masklayer 219 or the second hard mask layer 225 adjacent the dummy fin 227(as shown above in FIGS. 77A-D), the metal gate structures 234A-F maycontact (and thus make electrical connection to) the buried metal 222 orthe buried metal 224 as desired. In this manner, the metal gatestructures 234A-F may also be isolated from the buried metal 222 or theburied metal 224. For example, as shown in FIG. 79B, the metal gatestructures 234A and 234B are isolated from one another by STI 228, areisolated from the buried metal 222 by the first hard mask layer 219, andare isolated from the buried metal 224 by the second hard mask layer225.

The embodiments herein may achieve several advantages. For example, theprocess described allows for electrical connections to be made fromburied metal lines to the metal gates of FinFETs. By forming buriedmetal lines as described herein, the width of metal lines may bereduced, and thus the area of a FinFET device may be reduced.Additionally, the use of different selectively-etched materials toisolate the metal lines from different metal gates reduces the chance ofinadvertently connecting isolated metal gates to a buried metal lineduring processing. Because the connection between the metal gate and theburied metal is self-aligned to the buried metal, the separation betweenthe metal gate isolation (e.g., third material 116A in FIGS. 48A-D ordummy fin 227 in FIGS. 79A-D) and the connection may be reduce oreliminated. In some cases, the techniques described herein may allow forreduced risk of inadvertent metal gate connections when the pitchbetween fins is less than about 20 nm. The techniques described hereinmay also be used for FinFET devices such as a 6-fin FinFET cell withoutincreasing the area of the device. The techniques described herein mayalso be used for low-height FinFET cells, such as FinFET cells having aheight less than about 7 nm.

In an embodiment, a method includes etching a first recess in asemiconductor substrate, depositing a conductive material within therecess, etching a second recess in the substrate to expose a firstsidewall of the conductive material, depositing a first dielectricmaterial within the second recess, etching a third recess in thesubstrate to expose a second sidewall of the conductive materialopposite the first sidewall, depositing a second dielectric materialwithin the third recess, forming a first set of fins in thesemiconductor substrate, the first set of fins disposed on a first sideof the conductive material and a second set of fins in the semiconductorsubstrate, the second set of fins disposed on a second side of theconductive material opposite the first side, etching the firstdielectric material to expose the first sidewall of the conductivematerial, forming a first metal gate structure over the first set offins, the first metal gate structure contacting the exposed firstsidewall of the conductive material; and, forming a second metal gatestructure over the second set of fins. In an embodiment, the methodfurther includes forming a hard mask layer over the conductive material,the hard mask layer extending over the conductive material from thefirst conductive material to the second conductive material. In anembodiment, the method further includes forming a third set of fins inthe semiconductor substrate, the third set of fins disposed on the firstside of the conductive material, and forming a third metal gatestructure over the third set of fins, wherein the third metal gatestructure is isolated from the conductive material by the firstdielectric material and the hard mask layer. In an embodiment, etchingthe first dielectric material includes performing an etching processthat is selective to the first dielectric material over the seconddielectric material. In an embodiment, the method further includesetching the second dielectric material to expose the second sidewall ofthe conductive material, wherein the second metal gate structurecontacts the exposed second sidewall of the conductive material. In anembodiment, etching the second dielectric material includes performingan etching process that is selective to the second dielectric materialover the first dielectric material. In an embodiment, the method furtherincludes forming a dummy fin including a third dielectric material overthe conductive material, the dummy fin separating the first metal gatestructure from the second metal gate structure. In an embodiment, thefirst dielectric material includes silicon oxide and the seconddielectric material includes silicon nitride.

In an embodiment, a method includes forming a first recess in asubstrate and a second recess in the substrate, the second recessseparated from the first recess, forming a first buried metal line inthe first recess and a second buried metal line in the second recess,forming a first dielectric material over the first buried metal line,forming a second dielectric material over the second buried metal line,forming first multiple semiconductor fins adjacent the first buriedmetal line, forming second multiple semiconductor fins adjacent thesecond buried metal line, selectively etching a portion of the firstdielectric material to expose a portion of the first buried metal line,selectively etching a portion of the second dielectric material toexpose a portion of the second buried metal line, forming a first dummygate structure over the first multiple semiconductor fins and theexposed portion of the first buried metal line, forming a second dummygate structure over the second multiple semiconductor fins and theexposed portion of the second buried metal line, replacing the firstdummy gate structure with a first metal gate structure, and replacingthe second dummy gate structure with a second metal gate structure. Inan embodiment, the method further includes forming third multiplesemiconductor fins adjacent the first buried metal line, the thirdmultiple semiconductor fins separated from the first multiplesemiconductor fins, and forming a third dummy gate structure over thethird multiple semiconductor fins, wherein the third dummy gatestructure is isolated from the first buried metal line by the firstdielectric material. In an embodiment, the first buried metal line isformed before forming the second recess. In an embodiment, the firstmultiple semiconductor fins are part of a six-transistor (6T) FinFETcell. In an embodiment, the method further includes forming aninter-layer dielectric (ILD) region surrounding the first multiplesemiconductor fins and the second multiple semiconductor fins. In anembodiment, a portion of the ILD region is disposed between the firstmetal gate structure and the second metal gate structure. In anembodiment, the exposed portion of the first buried metal line isadjacent the exposed portion of the second buried metal line.

In an embodiment, a semiconductor device includes a buried metal linedisposed in a semiconductor substrate, a first dielectric material on afirst sidewall of the buried metal line and a second dielectric materialon a second sidewall of the buried metal line, a first multiple finsdisposed proximate the first sidewall of the buried metal line, a secondmultiple fins disposed proximate the second sidewall of the buried metalline, a first metal gate structure over the first multiple fins and overthe buried metal line, wherein the first metal gate structure extendsthrough the first dielectric material to contact the buried metal line,and a second metal gate structure over the second multiple fins and overthe buried metal line. In an embodiment, the second metal gate structureextends through the second dielectric material to contact the buriedmetal line. In an embodiment, the first dielectric material is differentthan the second dielectric material. In an embodiment, the second metalgate structure is isolated from the second sidewall of the buried metalline by the second dielectric material. In an embodiment, the firstmetal gate structure is isolated from the second metal gate structure.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

In the claims:
 1. A method comprising: etching a first recess in asemiconductor substrate; depositing a conductive material within thefirst recess; etching a second recess in the semiconductor substrate toexpose a first sidewall of the conductive material; depositing a firstdielectric material within the second recess; etching a third recess inthe semiconductor substrate to expose a second sidewall of theconductive material opposite the first sidewall; depositing a seconddielectric material within the third recess; forming a first set of finsin the semiconductor substrate, the first set of fins disposed on afirst side of the conductive material and a second set of fins in thesemiconductor substrate, the second set of fins disposed on a secondside of the conductive material opposite the first side; etching thefirst dielectric material to expose the first sidewall of the conductivematerial; forming a first metal gate structure over the first set offins, the first metal gate structure contacting the exposed firstsidewall of the conductive material; and forming a second metal gatestructure over the second set of fins.
 2. The method of claim 1, furthercomprising forming a hard mask layer over the conductive material, thehard mask layer extending over the conductive material from the firstdielectric material to the second dielectric material.
 3. The method ofclaim 2, further comprising forming a third set of fins in thesemiconductor substrate, the third set of fins disposed on the firstside of the conductive material; and forming a third metal gatestructure over the third set of fins, wherein the third metal gatestructure is isolated from the conductive material by the firstdielectric material and the hard mask layer.
 4. The method of claim 1,wherein etching the first dielectric material comprises performing anetching process that is selective to the first dielectric material overthe second dielectric material.
 5. The method of claim 1, furthercomprising etching the second dielectric material to expose the secondsidewall of the conductive material, wherein the second metal gatestructure contacts the exposed second sidewall of the conductivematerial.
 6. The method of claim 5, wherein etching the seconddielectric material comprises performing an etching process that isselective to the second dielectric material over the first dielectricmaterial.
 7. The method of claim 1, further comprising forming a dummyfin comprising a third dielectric material over the conductive material,the dummy fin separating the first metal gate structure from the secondmetal gate structure.
 8. The method of claim 1, wherein the firstdielectric material comprises silicon oxide and the second dielectricmaterial comprises silicon nitride.
 9. A method comprising: forming afirst recess in a substrate and a second recess in the substrate, thesecond recess separated from the first recess; forming a first buriedmetal line in the first recess and a second buried metal line in thesecond recess; forming a first dielectric material over the first buriedmetal line; forming a second dielectric material over the second buriedmetal line; forming a first plurality of semiconductor fins adjacent thefirst buried metal line; forming a second plurality of semiconductorfins adjacent the second buried metal line; selectively etching aportion of the first dielectric material to expose a portion of thefirst buried metal line; selectively etching a portion of the seconddielectric material to expose a portion of the second buried metal line;forming a first dummy gate structure over the first plurality ofsemiconductor fins and the exposed portion of the first buried metalline; forming a second dummy gate structure over the second plurality ofsemiconductor fins and the exposed portion of the second buried metalline; replacing the first dummy gate structure with a first metal gatestructure; and replacing the second dummy gate structure with a secondmetal gate structure.
 10. The method of claim 9, further comprising:forming a third plurality of semiconductor fins adjacent the firstburied metal line, the third plurality of semiconductor fins separatedfrom the first plurality of semiconductor fins; and forming a thirddummy gate structure over the third plurality of semiconductor fins,wherein the third dummy gate structure is isolated from the first buriedmetal line by the first dielectric material.
 11. The method of claim 9,wherein the first buried metal line is formed before forming the secondrecess.
 12. The method of claim 9, wherein the first plurality ofsemiconductor fins are part of a six-transistor (6T) FinFET cell. 13.The method of claim 9, further comprising forming an inter-layerdielectric (ILD) region surrounding the first plurality of semiconductorfins and the second plurality of semiconductor fins.
 14. The method ofclaim 13, wherein a portion of the ILD region is disposed between thefirst metal gate structure and the second metal gate structure.
 15. Themethod of claim 9, wherein the exposed portion of the first buried metalline is adjacent the exposed portion of the second buried metal line.16. A semiconductor device comprising: a buried metal line disposed in asemiconductor substrate; a first dielectric material on a first sidewallof the buried metal line and a second dielectric material on a secondsidewall of the buried metal line; a first plurality of fins disposedproximate the first sidewall of the buried metal line; a secondplurality of fins disposed proximate the second sidewall of the buriedmetal line; a first metal gate structure over the first plurality offins and over the buried metal line, wherein the first metal gatestructure extends through the first dielectric material to contact theburied metal line; and a second metal gate structure over the secondplurality of fins and over the buried metal line.
 17. The semiconductordevice of claim 16, wherein the second metal gate structure extendsthrough the second dielectric material to contact the buried metal line.18. The semiconductor device of claim 16, wherein the first dielectricmaterial is different than the second dielectric material.
 19. Thesemiconductor device of claim 16, wherein the second metal gatestructure is isolated from the second sidewall of the buried metal lineby the second dielectric material.
 20. The semiconductor device of claim16, wherein the first metal gate structure is isolated from the secondmetal gate structure.